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China, Chinese Automatic Aluminum Wire Ultrasonic Welder/Shuttle 800b Wire Bonding Machine/High-Speed Wire Bonding Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductUltrasonic Aluminum Wire Welding MachineAsm/Factory Price
Guangzhou Minder-Hightech co.,Ltd
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Product Description Product DescriptionHigh-speed wire bonding machineUltra-quiet workbench, creating an excellent working environmentFully enclosed workbench extends the service life of mechanical partsMass separation XY table suitable for light load and high speed occasionsThe position is more precise, meeting the demanding requirements of 0.18μm process wafersCT3100Speed: 5 wires/second1. updated from CT3100, XP operation system, digital camera import from German, 15% faster than CT3100.2. Suit for small board bonding (quartz, watch, light, toys, LCM, etc. )CT3000Speed: 6 wires/secondSuit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).CT2300Speed: 6 wires/secondSuit for high precession, super multi-wires products single IC (as card reader, U disk, digital camera, telephone etc.).Shuttle 800B wire bonding machineFully enclosed copper wire gas protection device, anti-oxidation, low gas consumption;The chip and the pins are reserved at the same time, which can handle the support with uneven pin distribution;The high-resolution 1μm XY table ensures the accuracy of the equipment;Friendly human-computer interaction, classified design parameter menu, simple and easy to learn.SpecificationmodelCT2300CT3000CT3100AZ stroke0.4"Resolution1μmWire feeding degree30°30° (45° optional)Wire diameter1.0-2.0 MIL0.8-2.0 MIL1.0-2.0 MILBonding force15-80 gmBonding power0-2W adjustableBonding timeadjustableDistance between4.8 mmBonding head and baseWork stageXY stroke2"*2"2"*2"3"*3"Rotary rangeNo limitBase dimensionMax rotary R: 380mmtransducerLight weight aluminum alloyProcess scan range XY±1mm (Magnification 3.5 times)Process scan range rotary±15°Optical system2.5X process controlStorageUp to 99 programs, up to 1000 COB chips per program, up to 1000 lines per chipVoltage2 phase 220VFrequency50/60 HZPower800Wweight240kg270kg280kgsize1050*750*1400mm630*700*1350mm750*1050*1450mm Bonding speed50ms/wire for 2mmBonding accuracy±3.0 μmWire lengthMax.8mmWire diameter15-50μmWire typeAu, Ag, Alloy, CuPd, CuBond typeSingle line /BSOB/BBOSLoop controlSupport ultra-low arcBonding area56mm*65mmXY resolution0.1μmTransducer system138kHZPR accuracy±0.37μm,±0.74μmApplicable magazine120-305*45-98*50-180mmMagazine pitchMin 1.5mmApplicable lead frame100-300*40-90*0.1-1.3mmDifferent lead frame<5minSame lead frame<15minOperation interface<4minOverall dimensionChinese/Englishvolume950mm*920*1850mmWeight750kgVoltage190~240VFrequency50HZCompressed air0.6-0.97barAir consumtion80L/minSampleProduct detailsPacking & DeliveryTo better ensure the safety of your goods, professional, environmentally friendly, convenient and efficient packaging services will be provided.Our Factory
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