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China, Chinese Laser Induced Drilling Machine for Glass Substrate with Automatic Detection Undrilled Holes1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductGlass Substrate Laser Induced DrillingFactory Price
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product DescriptionProduct FeaturesCustomized picosecond/femtosecond laser. Laser flight pulse pointing, compatible withsingle point/spin cut drilling process. Integrated superior software algorithms that automatic optimization laser pointing andcutting paths and directionsAutomatic detection of undrilled holes ApplicationLaser induced drilling through holesand blind holes for special-shaped glass,glass, RF components, optoelectroniccomponents, photomask plates, MEMScomponents, glass based high-densitysubstrates, advanced wafer packaging,glass spacer chips, Mini/Micro LED displaypanel glass substrates, foldable screens, etcTechnical specification LaserUltra-fast picosecond / femtosecond laserProcessing Product SizeX/Y: 350×350mm 12" glass waferGlass thickness100-1500μmFocused spot diameter<3μmUPH≥5000 holes/secPlatform positioning accuracy≤±2μmRepeat Positioning Accuracy≤±1μmVision configuration10 million pixelsExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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