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China, Chinese High Quality Fully Automatic Soft Solder Die Bonding Machine Factory1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie Bonding MachineDie Bonder Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description High Quality Fully Automatic Soft Solder Die Bonding Machine Factory Product DescriptionThis equipment is a soft solder die bonder designed for thermal die bonding of TO power devices. This equipment is a new architecture designed for 12-inch wafer structure and is compatible with 8-6-inch products. It also takes into account the placement of large-size high-density lead frames, such as PDFN, TO252-8R, TO220/247/3P, photovoltaic devices, SOP, DPAK matrix, etc.Detailed Photos Product ParametersSystem CapabilitiesProductivity6-9k*(Double Tin + Matrix Lead Frame PDFN-10R)Solder Thickness1mil-3milWafer Tilt< 2mil (Chip Size <150x150mil)<1° (Chip Size >150x150mil)Soft Solder Voids2% (Single Void) & 5% (Total Wafer Area)Soft Solder Coverage100% (Wafer to Pad Edge >10mil)XY Position Accuracy± 1.5mil (38μm)Angular Deflection±2°Material Handling CapabilitiesWafer Size20x20-560x560mil(0.5x0.5-14x14mm)Substrate SizeLength4.33"-11.81" (110-300mm)Width0.47"-4" (12-102mm)Thickness4-39mils (0.1-1mm)Box sizeLength4.33"-11.81" (110-300mm)Width0.63"-4.72" (16-120mm)Height2.68"-6.30" (68-160mm)Machine size and weightWidth x depth x height1,900x1,400x1,700mm3WeightApproximately 1600KGBonding systemBonding pressure30-300g (programmable)Wafer systemWafer size12 inches, 8 inches (optional), 6 inches (optional)Solder handling capacityTin wire diameter0.25-1mmTin delivery modeSn, write, press (optional)Heating trackHeating zone8Cooling zone3Maximum operating temperaturePreheating zone450°CSn/bonding zone450°CCooling zone450°CTemperature accuracy±3°CPower systemCompressed air250 LPM @ 3bar, minimum 3bar23 LPM @ 3bar, minimum 3bar,Mixed air15%H2 + 85%N2Vacuum>-8barVoltage220/240 VACFrequency50/60 HzMaximum load current10A |29APower consumptionApproximately 1,100WApproximately 2,200W Exhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonding,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment. Packaging & ShippingFAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:Why choose us ?A3:OEM/ODM/Designing.
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