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China, Chinese China High Vacuum Chip Soldering Reflow Oven / Furnace for IGBT MOS1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Reflow OvenVacuum Reflow OvenVacuum Soldering Oven
Termway (Beijing) Precision Technology Co., Ltd.
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Product Description China High Vacuum Chip soldering reflow oven / furnace for IGBT MOSModel: HV3-3Application:IGBT/DBCPower SemiconductorsSensorsMEMS DevicesDIE AttachmentHigh Power LEDHybrid AssemblyFlip ChipPackage SealingFeature of the vacuum reflow oven:1. Soldering temperature: the maximum soldering temperature of HV3-3 vacuum eutectic furnace is ≥ 500 oC. 2. Vacuum degree: limit vacuum degree ≤ 10-6 PA working vacuum: 10-6 PA. 3. Effective welding area: ≥ 300mm * 300mm 4. Furnace height: ≥ 100mm, customized for special height. 5. Heating method: infrared heating at the bottom + infrared heating at the top. The heating plate adopts semiconductor silicon carbide graphite platform. It is not easy to deform after long-time use, and has high thermal conductivity, making the surface temperature of the heating plate more uniform. 6. Temperature uniformity: within the effective soldering area ≤± 2%. 7. Heating ramp:120 oC / minute. 8.Cooling ramp: 60-120 oC / minute (the ramp of no-load, temperature cooling from 100 oC).9. Meet the soldering requirements of soldering materials temperature≤ 500 oC. For example: In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 and other preforms (can be soldered without flux eutectic), solder paste of various components, and curing of materials below 500 degrees.10. Soldering void rate: After a large number of customer verification, when HV3-3 vacuum eutectic furnace solder with soft solder, the void rate can be controlled between 0-3%. Vacuum reflow furnace Technical parameter: ModelHV3-3Soldering Size300*300mmFurnace height100mm(other Hights is optional)Maximum Temperature500oCvacuum≤3Pa with mechanical pump,≤10-6Pa with molecular pump Heat up ramp120 oC / minuteCool down ramp60-120 oC / minute Voltage220V, 25-60ARated Power18KWWeight360kgDimension600*600*1300mmWight250KGThe maximum heating rate120oC/minThe maximum cooling rateOnly water-cooled 60oC/min, Air-cooled + water-cooled 120oC/minCooling WayAir-cooled / water-cooled (shell, heating plate)Soldering result:Company information:
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