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China, Chinese High Speed Automatic Die Attach Machine Die Bonder1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterDie BonderDie Attach
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description DA1201 IC Linear High Precision Die AttachWafer size: 6"- 12";Dual dispensing system;High-precision linear driven bond head;Support DAF function;Multifunction work table, suitable for different kinds of lead frames & substrates;High-precision wafer table with highly accurate die rotation system and motorized wafer expansion system;Intelligent dispensing control system to realize precision glue volume control;Missing die detection and re-picking function;Programmable Pick / Bond Force;Customization for special design is also available.DA1201 Equipment Specifications CategoryParameterSpecificationNotesSystem PerformanceCycle Time230msHigh-speed operation for efficient production X/Y Placement Accuracy±10-25μm @3σEnsures precise component positioning Theta Placement Accuracy±1° @3σHandles rotational alignment needsMaterials HandlingDie Size0.15×0.15mm - 25×25mmVersatile for microelectronics to power components Die Thickness (Standard)0.076-1mm (3-40 mils)Suitable for standard applications Die Thickness (Optional)0.05mm (2 mils)For ultra-thin dies in advanced packaging Substrate DimensionsLength: 100-300mm, Width: 40-100mm, Thickness: 0.1-0.8mm (Standard), 0.8-2.0mm (Optional)Flexible substrate compatibility Magazine Dimensions110-310mm × 20-110mm × 70-153mmOptimized for storage and feedingWafer SystemWafer Size6" - 12"Industry-standard wafer capability Auto-Theta Alignment±10°Corrects minor rotational misalignmentBond Head SystemBond Force20-500g (Programmable)Adjustable for delicate or robust bondingWorkholder SystemTrackwidth40-100mm (Customizable)Adaptable to various substrate widthsPattern RecognitionPR SystemMulti-color PREnhanced component recognition Resolution1920×2560 pixels (Customizable)High-resolution imaging Pixel & FOV5M (1920×2560 pixel), FOV: 16mm (x1, x2, x4)Flexible imaging options Angular Accuracy±0.1°Precise rotational alignment detectionDimensions & WeightDimension (L×W×H)2250 × 1650 × 1750 mmRequires adequate facility space Weight1600kgHeavy-duty construction, needs proper floor supportExhibition & CustomersJiangsu Himalaya Semiconductor Co., Ltd. Was established in 2019, mainly engaged in international trade and integration of semiconductor industry equipment. The equipment is currently imported and exported to over 30 countries, with over 200 customers and suppliers, aiming to control the procurement of the highest cost-effective products in the final stage for customers, and strive for one-time payment collection and risk avoidance for suppliers!Our main products:Die Bonder,Wire Bonding,Laser Marking(ID IC Wafer),Laser Grooving,Laser Cutting(Glass Ceramics Wafers Packaging,Laser Internal Modification Machine Si /Sic Wafe,Laser Internal Modification Machine Lt/Ln Wafer,Laser Annealing Machine for Si/Sic,Automatic Dicing Saw Machine(Wafer Packaging)),Automatic Silicone Dispensing Equipment.Packaging & Shipping FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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