IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese Precision Wire Bonder: Unmatched Versatility for Power Devices and Advanced Packaging1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterAutomated Wire BonderSemiconductor Packaging Equipment
Jiangsu Himalaya Semiconductor Co., Ltd.
Preview:
Product Description Product DescriptionOur advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x 300mm work area, providing exceptional positioning accuracy of ±1μm on all linear axes (X, Y, Z) for precise bond placement on large panels and complex substrates.This versatile system supports a comprehensive range of wire types, including round aluminum wire (5-20 mil), heavy copper wire (up to 8000g bond force), and broad ribbon wire (20x4 mil to 80x10 mil). Equipped with a motorized wire feed system featuring high-resolution encoder feedback and real-time wire loss detection, it guarantees consistent loop formation and immediate error prevention. The ultrasonic system, with 60kHz or 80kHz transducers, ensures optimal energy delivery for a perfect bond every time.Designed for maximum uptime and efficiency, it boasts a rapid cycle time of less than 1 second per wire and offers quick-change bond head capabilities to minimize tooling switchover time. With its integrated process monitoring and robust 900kg frame ensuring stability, this wire bonder is the ideal solution for demanding production environments in power devices, RF modules, and advanced semiconductor packaging that require unwavering quality, versatility, and speed. Long gantry XY axis for large working area? Bond quality control and assessment? Direct drive linear motor and flying vision systems improve efficiency? Quickly change of ultrasonic bond head supports aluminum wire, aluminum ribbon and copper wire bonding Parameter No.DescriptionParameter1Work AreaX axis: 300 mm / +/-1 umY axis: 300 mm / +/-1 umZ axis: 50 mm / +/-1 umT axis: +/-360° / +/-0.01°2Wire Size (Round)5 mil to 20 mil (125 um ~ 500 um)3Ribbon Wire Size20x4 mil to 80x10 mil4Wire CutterFront cut / Rear cut5Wire Feed SystemMotorized with High Resolution Encoder Feedback6Wire Loss DetectionEncoder and Bond Power Detection Method7Maximum Wire Length TrackingReal-Time Monitoring8Bond ForceAluminum wire: 50g - 1500gRibbon wire: 100g - 3500gCopper wire: 100g - 8000g9Ultrasonic Transducer60 kHz or 80 kHz10Ultrasonic Generator60 kHz or 80 kHz @ 30W ~ 100W11Wire Cycle Time< 1 second12Power Supply200-240V AC, 50-60 Hz, 2000W13Dimensions (L x W x H)960 mm x 1400 mm x 1700 mm14Weight900 kg AdvantageKey Features X and Y Axis Travel: 300 mm with ±1 μm accuracy. This indicates a long-reach gantry system, essential for handling large substrates, panels, or multiple devices in a single load. The ±1 μm precision is critical for fine-pitch bonding.Z Axis Travel: 50 mm with ±1 μm accuracy. This provides sufficient vertical movement for tall package stacks and consistent tool touchdown.T Axis (Rotation): ±360° with ±0.01° accuracy. This is the rotational axis of the bond head, allowing for perfect angular alignment of the wedge tool to the bond pad, which is crucial for ribbon wire and consistent heel formation.2. Wire Handling Capabilities (No. 02, 03, 04, 05, 06, 07):Wire Size Range (Round): 5 mil to 20 mil (125 μm to 500 μm). This covers the most common range, from very fine wires for sensitive ICs to heavy wires for high-current applications like power semiconductors.Ribbon Wire Range: 20x4 mil to 80x10 mil. Ribbon wire is used for applications requiring high current carrying capacity and improved thermal performance (e.g., power modules, RF transistors).Wire Cutter: Configurable for Front Cut or Rear Cut. This defines the direction the tail is cut after the second bond, a parameter that affects loop shape and tail length for the next bond.Wire Feed System: Motorized with High-Resolution Encoder Feedback. This is a key feature for precision. The encoder ensures an exact length of wire is fed for every bond, enabling extremely consistent loop heights and reliable tail lengths. It is far superior to older pneumatic systems.Wire Loss Detection: Uses a combination of encoder feedback (to detect if the wire spool didn't turn) and bond power monitoring (to detect if the ultrasonic energy signature is wrong because no wire was present). This real-time monitoring prevents making bonds without wire, saving scrap and downtime.Maximum Wire Length Tracking: Real-Time Monitoring. The system continuously tracks how much wire has been used from the spool, which is vital for production planning, maintenance scheduling, and ensuring a spool doesn't run out mid-job.3. Bonding Force & Ultrasonics (No. 08, 09, 10):Bond Force:Aluminum Wire: 50g - 1500gRibbon Wire: 100g - 3500gCopper Wire: 100g - 8000gAnalysis: The wide range, especially the high force for copper wire, is essential. Copper is harder than aluminum and requires significantly higher force to form a strong intermetallic bond. This machine is clearly built for demanding copper bonding applications.Ultrasonic System:Transducer Frequency: 60 kHz or 80 kHz. Higher frequencies (e.g., 80 kHz) are often used for smaller, more delicate structures and finer pitches, as they allow for lower deformation. Lower frequencies (e.g., 60 kHz) can be better for larger bonds and harder materials.Generator Power: 30W - 100W. The power output is adjustable to provide the precise ultrasonic energy needed to scrub the interface and create a solid-state weld without damaging the wire or the substrate.4. Performance (No. 11):Wire Cycle Time: < 1 second. This measures the time to complete one complete wire bond (first bond, loop, second bond, break/tear). A sub-second cycle time indicates a high-speed machine designed for mass production, achieving thousands of bonds per hour.5. Power & Physical Specifications (No. 12, 13, 14):Power Supply: 200-240V AC, 50-60Hz, 2000W. Standard industrial power requirement.Machine Dimensions: 960mm (L) x 1400mm (W) x 1700mm (H). Its footprint is relatively compact given its large work area.Weight: 900 kg. The substantial weight indicates a heavily built, rigid frame constructed from granite or heavy-duty metal. This mass is critical for damping vibrations caused by high-speed gantry movement and ultrasonic energy, ensuring they do not negatively impact positioning accuracy. FAQFrequently Asked Questions (FAQ)1. What types of wire and materials can this machine bond?This machine is highly versatile and is specifically designed to handle a wide range of bonding wires, including round aluminum wire (5-20 mil), heavy copper wire (requiring up to 8000g of force), and ribbon wire (from 20x4 mil to 80x10 mil). This makes it suitable for everything from delicate integrated circuits to high-power devices.2. How does the machine ensure consistent quality and detect problems?It features advanced real-time process monitoring. The key systems are:Encoder Feedback: Precisely controls wire feed length for consistent loops.Wire Loss Detection: Combines encoder data and ultrasonic power monitoring to instantly detect wire breaks or feed issues, stopping the machine to prevent defects.Bond Power Monitoring: Analyzes the ultrasonic energy signature to identify poor bonds as they happen.3. Is this machine suitable for high-volume production?Yes, absolutely. With a rapid cycle time of less than 1 second per wire and a large 300mm x 300mm work area that minimizes substrate handling, it is built for high-throughput manufacturing. Features like motorized wire feed and real-time monitoring maximize uptime and yield.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...