IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese High Speed Automatic Series automatic semiconductor wire ball bonder for IC LED package1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Other Manufacturing Equipments for Electrical Electronic ProductWire BondWire Bonder
Guangzhou Minder-Hightech co.,Ltd
Preview:
Product Description MD-S series automatic semiconductor wire ball bonderSpeed:21W/S for 2mmWelding line area: 56*80mmLeadframe width: 28-90mmApplication:IC(SOP,SOT,DIP,BGA,COB.)LED(SMD,COB) Advantage:Fully enclosed copper wire, nitrogen protection, anti-oxidation, low gas consumptionThe chip and pin are pre positioned at the same time, which can deal with the support with nonuniform pin distribution0.1um,+/-2um(High resolution 0.1um worktable, + / - 2umwelding line accuracy)EFO(High resolution EFO)(Full closed loop force control)2.5mil(2.5mil copper wire)(Optional Automatic conversion of product types) SpecificationBonding Capability48ms/w 2mm Wire LengthBongding Speed+/-2YmWire LengthMax 8mmWire Diameter15-65ymWire TypeAu,Ag,Alloy,CuPd,CuBonding Process/BSOB/BBOSLooping ControlUltra Low Looping<50ymBonding Area56*80mmXY Resolution)0.1umUltrasonic Frequence138KHZPR accuracy+/-0.37umApplicable Magazine(L)120-305mm(W)36-98mm(H)50-180mm(Pitch)Min 1.5mm(Applicable Leadframe)(L)100-300mm(W)28-90mm(T)0.1-1.3mmConversion TimeDifferent Leadframe<15minSame Leadframe<4minOperation InterfaceMMI LanguageChinese,EnghiseDimension, WeightOverall Dimension)W*D*H950*920*1850mmWeight750KGFacilitiesVoltag190-240VFrequency50HzCompressed Air6-8BarAir Consumtion80L/minWe have 16 years of experience in equipment,and we can provide you with a one-stop IC Package Line Equipment solution !!
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...