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China, Chinese Semiconductor Packaging Equipment/LED/High Precision Die Bonder/Die Bonding Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterBonding Machine Die AttachHigh-Speed Die Attach
Jiangsu Himalaya Semiconductor Co., Ltd.
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Product Description Product Description PrecisionHigh PrecisionConditionNewCertificationISOWarranty12 MonthsAutomatic GradeAutomaticInstallationVerticalDriven TypeElectricTransport PackageCustomized or Wooden Box PackagingTrademarkHimalayaProduction Capacity1Automatic loading and unloading crystal fixing machineFully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support productsModular design, new optimized layout, focus on quality, with the best stable performanceYou can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customersBrand-new tying head design, fast die bond cycle up to 180msPatented head binding, accurate positioning and more stable operation;5mil small chip processing capacityDesign a variety of chip search methods, suitable for the search of various shapes of wafersUltra-long PIN (65ms) processing capability to meet different customer needs Detailed PhotosClip Bonder High-speed Clip Bonding Systemplacement accuracy: ±50μm @3σ, theta placement accuracy: ±3°@3σ;Up to 20Clips / Cycle;Prebond & Posbond function;Solder patch & solder paste inspection function;High precision linear drive die bond head;High precision clip punching system;The multi dispensing independent control system provides more accurate glue control, equipped with glue detection, with automatic glue filling function;Multiple configurations meet various market demands, as well as customization according to special demands;Freely match various types of reflow equipment.Advantages of Die AttachDA801/DA1201 can be configured;Placement accuracy: ±10-25μm@3σ;Theta placement accuracy: ±1°@3σ;Stable force control system;Dual dispensing system, support dipping / jetting / writing epoxy process. Exhibition & CustomersField Application FAQQ1:How to choose a suitable machine?A1:You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience. Q2:What is the warranty period for the equipment?A2:One year warranty and 24 hours online professional technical support.Q3:How to choose a suitable machine?A3:You can tell us the request of machine function. We can recommend the most suitable machine according to our experience.
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