IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese RS330 Vacuum Reflow Soldering Oven for Laser, Micro LED, Endoscope1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Reflow OvenMicro LEDEndoscopeVacuum OvenReflow Oven
Termway (Beijing) Precision Technology Co., Ltd.
Preview:
Product Description RS330 Vacuum Reflow Soldering Oven for Laser, Micro LED, Endoscope1.Introduction:RS series Vacuum Reflow Oven are especially designed for the fields in small batch production, R&D and functional materails test, etc.In general, when soldering, there're some hollow areas in soldering parts, RS series Vacuum Reflow Oven can minimize the hollows into 2%.RS series Vacuum Reflow Oven applicable to fluxless soldering, available in various of gases, such as N2, N2/H2 95%/5%.RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder foil.RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.Specification: ModelRS220RS330Soldering Size220mm*220mm 330*330mmChamber height100mm(other heights are optional)Temperature Up to 450oCHeaterInfrared + Hard graphite (SiC coating)Inert gasNitrogen + formic acidConnector Serial 485 network / USBControl Way40 segments Temperature control + PID controlTemperature curve can store several curves Temperature of 40 segmentsVoltage220V 25A 220V 28A Rated Power9KW 11KWActual Power 6KW(Don't choose a vacuum pump)8KW(configurate molecular pump)8KW(configurate molecular pump)10KW(configurate molecular pumpThe maximum heating rate120C/min.120C/min.The maximum cooling rate120k/min(water+nitrogen)120/min(water+nitrogen) Cooling WayAir-Cooled/ Water-Cooled Air-cooled /water-cooledDetailProductsApplication:Mainly applied in fluxless soldering between chips and board, Shell and cover, such as IGBT package, paste crafts, Laser diode packaging, Hybrid integrated circuit packages, shell cover Board packaging, MEMS and vacuum packaging;Features:1. Soldering under full vacuum. The vacuum value can be up 10-3mba. 2. Professional software control can achieve the perfect operating experience.3. 40 industry segments programmable temperature control system can help to set the perfect technology curve.4. Water-cooling technology achieves the industry's fastest cooling effect (standard)5. Online temperature measurement function. Accurate measurement of the heat zone temperature uniformity. Provide professional support for the process of adjustment.6. Nitrogen or other inert gas can meet the special requirements of the soldering process.7. Highest temperature is 450 oC (higher optional), which can meet all the requirements of the soldering process.8. Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (over heating protection, temperature safety protection, safe operation protection, cooling water protection, power protection)Standard:one set computerone set industry control computer one set temperature control softwareone set temperature controllorone set pressure controllorone set Inert gas( nitrogen)control;Optional:1.Chiller2.Vacuum Pump (mechanical oil or oil-free pump)3. Hydrogen and Nitrogen mixer (95%N2 5%H2)
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...