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China, Chinese High Speed Precision Automatic Semiconductor Equipment IC Package Wafer Die Bond Die Bonding Attach Eutectic Crystal Planting Machine1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterEutectic Crystal Planting MachineDie Bonder
Guangzhou Minder-Hightech co.,Ltd
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Product Description Since 2014,One-stop Professional Solution for Semiconductor Front-end and IC TO Package Equipments LineAutomatic die bonder for Semiconductor industry IC package MD-JC360-D MD-JC380-D MD-JC360 MD-JC380 MD-JC360i MD-JC380i MDAX64DI MD-1412Automatic loading and unloading die bonderFully automatic loading and unloading, suitable for SMD, 1W and integrated high-power COB surface light source, triode and other flat support products;Modular design, new optimized layout, focus on quality, with the best stable performance;You can flexibly choose different configurations such as four crystal rings, double dispensing heads, double glue plates, 25cm long brackets, etc., to create the most suitable products for customers;Brand-new tying head design, fast die bond cycle up to 180ms;Patented head binding, accurate positioning and more stable operation;5mil small chip processing capacityDesign a variety of chip search methods, suitable for the search of various shapes of wafersUltra-long PIN (65ms) processing capability to meet different customer needs.Bonding armBonding arm90 degreeMotorAC servo motoWafer work stageStroke6"*6"resolution0.2 mil (5μm)Lead frame wore stageLead frame number1PCStroke10"*6"Resolution0.2 mil (5μm)Die and wafer Die dimension5mil*5mil~100mil*100milWafer dimension6 :±3°:±1.5mil 25g~35g Ejector system Sync with the part Can adjust the height Epoxy picking systemEpoxy picking armRotary typemotoAC servo motoImage recognition systemMethod256 grayResolution1024*768Optical rate0.7~4.5xAccuracy1.56 μm~8.93 μmspeedBonding cycle180msProgram storageProgram storage100Maximum number of chips per carrier1024Number of single carrier boards1Die lost checking systemMethodVacuum sensorRequirementVoltageAC 220V/50 HZCompressed air≥0.6MPa,70L/minVacuum600mmHgMaximum power1800WWeight680KGdimension1310*1265*1777mmEquipment real shootWe have 16 years of experience in equipment sales ,and can provide you with a one-stop IC Package Line Equipment solution!Frequently Asked Questions1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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