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China, Chinese Semiconductor Chip Manufacture Photolithography Photomask Substrate Alignment Exposure Mask High Precision Mask Aligner1 Industrial Products Supplier Manufacturer Details, price list catalog:
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Other Manufacturing Equipments for Electrical Electronic ProductMask AlignerLithography
Guangzhou Minder-Hightech co.,Ltd
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Product Description Mask Aligner Lithography MachineMask Aligner Also known as: mask alignment exposure machine, exposure system, lithography system, etc., is the core equipment for manufacturing chips. It uses the technology similar to photo printing to print the fine patterns on the mask onto the silicon wafer by light exposure.Mainly composed of: high-precision alignment workbench, binocular separated field of view vertical microscope, binocular separated field of view horizontal microscope, digital camera, computer imaging memory system, multi-point light source (fly eye) exposure head, PLC control System, pneumatic system, vacuum system, direct-connected vacuum pump, secondary anti-vibration workbench and accessory box.Characteristic:High uniformity fly-eye exposure head / air flotation leveling mechanism / reliable vacuum clamping exposure.Above feature make sure the high resolution and high uniformity.Aligning method by mask keep stable and substrate feeding, which make sure the consistency of the guide gravity and the force.Using gapless straight guide, high precision, fast speed.Manufacturing high-precision alignment system needs to have nearly perfect precision mechanical process. Another technical problem of alignment system is alignment microscope. In order to enhance the field of view of microscope, many high-end lithography machines use LED lighting. There are two sets of alignment system with focusing function. It is mainly composed of two eyes and two fields of view aiming at the main body of the microscope, one pair of eyepiece and one pair of objective lens (lithography machine usually provides eyepiece and objective lens with different magnification for users). The function of CCD alignment system is to enlarge the alignment marks of mask and sample and image them on the monitor.The work piece stage is a key part of the lithography machine, which is composed of the mask sample overall motion stage (XY), the mask sample relative motion stage (XY), the rotation stage, the sample leveling mechanism, the sample focusing mechanism, the wafer stage, the mask clamp and the pull-out mask stage.The sample leveling mechanism comprises a ball seat and a hemisphere. In the leveling process, firstly, pressure air is applied to the ball seat and hemisphere, and then the ball seat, hemisphere and sample piece move upward through the focusing hand wheel, so that the sample piece can be leveled against the mask, and then the two position three-way solenoid valve switches the ball seat and hemisphere to vacuum for locking to maintain the leveling state.1, Main usesIt is mainly used in the development and production of small and medium scale integrated circuits, semiconductor components, optoelectronic devices, surface acoustic wave devices, thin film circuits and power electronic devices.2, Main componentsIt is mainly composed of a high-precision special copy mechanism, a dual field CCD micro display system, two multi-point light source light exposure heads, a vacuum pipeline system, a gas circuit system, a direct connected vacuum pump, and a shock proof workbench. ManufacturerMinder-hightechMinder-hightechMinder-hightechMinder-hightechModelMD-G25AMD-G25DMD-G31MD-G33Exposure typeOne sideOne sideDouble side alignment and double side exposureExposure head NO.1 Exposure head1 Exposure head2 Exposure head2 Exposure headCooling methodAir coolingAir coolingAir coolingAir coolingType of light sourceMercury lamp sourceUltraviolet light sourceMercury lamp sourceUltraviolet light sourceExposure area≤?100mmΦ100mm≤?120mm≥?115mmExposure modeContact exposuremicro-force paralleling technologymicro-force paralleling technologymicro-force paralleling technologyLight sourcemercurymercuryUV-LEDUV-LEDExposure unevenness?100mm<±4%≤±3%?100mm≤±6%≤±3%Exposureintensity≥20mw/cm2(365nm,404nm,435nmCombined UV)Substrate thickness1-5mm≤5 mm0.1-1mm≤5 mmExposure resolution3μm1 μm1 μm1 μmAlignment accuracy±0.5μm1 μmPositive:1 μm / On the other side:3-5μm1 μmLighting range?115mm?117mm?120mmFront and back ≥ ?115mmCamera systemBinocular separation systemdual-field CCD systemdual-field CCD systemdual-field CCD systemMicroscope system50-375 continuous zoom91x ~ 570X continuous zoom (objective lens 1.6x ~ 10x continuous zoom), the adjustable range of double objective lens distance is 50mm ~ 120mm0.7-4.5 continuous zoom60x, 120x continuous zoom (objective magnification 2x, 4x two), double objective adjustable distance 25mm-70mmMinder-Hightech is sales and service representative in semiconductor and electronic product industry equipment. Since 2014,the company is committed to providing customers with Superior, Reliable, and One-Stop Solutions for machinary equipment. FAQ1. About Price:All of our prices are competitive and negotiable. The price varies depending on the configuration and customization complexity of your device.2. About Sample:We can provide sample production services for you, but you may provide some fees.3. About Payment:After the plan is confirmed, you need to pay us a deposit first, and the factory will start preparing the goods. After the equipment is ready and you pay the balance, we will ship it.4. About Delivery:After the equipment manufacturing is completed, we will send you the acceptance video, and you can also come to the site to inspect the equipment.5. Installation and Debugging:After the equipment arrives at your factory, we can dispatch engineers to install and debug the equipment. We will provide you with a separate quotation for this service fee.6. About Warranty:Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
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