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China, Chinese High Precision Manual Epoxy Die Bonder of IC Packaging Equipment for Laboratory Use1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Chip MounterWire BonderDie Bonder
Guangzhou Minder-Hightech co.,Ltd
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Product Description Manual Epoxy die bonderModel: MDSJHYZP0225 Features:1. It can realize the function of automatic scribing of various patterns such as single-point dispensing, rectangle, rice character, etc.2. Realize the soft contact of the suction nozzle, effectively solve the problem of the active area such as the air bridge on the surface of the GaAs chip3. Non-damage flattening adjustment for uneven patch or large-sized chips4. Dispensing and patch are integrated, integral, convenient or double-head patch function, improve efficiencyProduct advantages:Function:Automatic scribing, dispensing, stickingBonded Chip Size:0.2-25mmAdhesive pressure:10-150gLifting table size:X-Y:250*270mm Z:18mControl platform effective travel:X-Y:10mm*10mm Z:25mmMotion Control Platform Accuracy:0.2umNozzle rotates 360°Chinese self-naming parameter file name storage, easy to rememberWith automatic height detection functionLater upgradeable epoxy eutectic machine Product maintenance:Parameterspower supply:AC220V±10%,50-60HZ,≤400WCompressed air>=0.5MPaVacuum pipeline <-0.08MPaExternal dimensions:800*380*450mmweight:70KGstable workbench keep away from vibration sourcesEchnical Services:There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteedMore than 5 years of domestic technical service experience on similar equipmentAfter-sale warranty1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two yearsRespond within 12 hours, arrive at the scene within 72 hours
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