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China, Chinese Low-Profile Skiving Fin Heat Sink for Compact Electronic Devices1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Metal Processing Machinery PartsLow-Profile Heat SinkSkiving Fin Heat Sink
Beijing Duoyang Gigamega Technology Co., Ltd.
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Product DescriptionProduct DescriptionSHOVEL HEAT SINK High-Performance Aluminum Shovel Heat Sink designed for optimal thermal dissipation and cooling efficiency. This lightweight heat sink features a distinctive shovel-shaped profile that maximizes surface area while maintaining compact dimensions for space-constrained applications.KEY FEATURES & BENEFITS: Superior Heat Transfer Performance - The innovative fin design and enhanced surface area provide exceptional thermal conductivity (typically 200+ W/mK), ensuring rapid heat dissipation from CPUs, LEDs, power electronics, and semiconductor devices. Precision Engineering - Manufactured from high-grade 6063 aluminum alloy with anodized surface treatment for enhanced corrosion resistance and durability. The machined base ensures perfect thermal interface contact. Versatile Mounting Options - Compatible with standard thermal adhesive, thermal tape, or mechanical fastening systems. Suitable forSpecificationTECHNICAL PARAMETERSProduct NameShovel Heat SinkKeywordsAluminum Shovel-Tooth Heat SinkLength50.0 ± 0.2mmWidth25.0 ± 0.2mmHeight38.0 ± 0.3mmWeight45 ± 3gThermal Conductivity205W/m·KThermal Resistance2.5°C/WMaximum Power Dissipation25WBase Material6063-T5 Aluminum AlloySurface TreatmentAnodized FinishDetailed PhotosADVANCED DIRECTIONAL HEAT FLOW DESIGN Unique shovel geometry optimizes heat channeling from source to ambient air, delivering 30% faster heat dissipation compared to traditional flat heat sinks through engineered airflow patterns. UNIVERSAL COMPATIBILITY & QUICK INTEGRATION Standard footprint design fits 90% of common electronic packages, including TO-220, TO-247, and custom PCB layouts. Tool-free mounting with pre-applied thermal interface reduces installation time by 75%. EXTENDED COMPONENT LIFESPAN PROTECTION Maintains junction temperatures below critical thresholds, extending component lifespan up to 3x longer. Prevents thermal cycling damage and performance degradation in mission-critical applications. SPACE-OPTIMIZED COMPACT FORM FACTORVertical heat channeling design achieves maximum cooling capacity in minimal PCB real estate. Low-profile construction enables dense component placement without compromising thermal performance.FAQQ1: Are you a factory or a trader?A: We are a manufacturer integrating industry and trade. Welcome to visit our company. Q2: Can I add my LOGO to the product?A: We support on-demand customization, including LOGO customization, color customization, appearance size customization, etc. Q3: What payment methods do you support?A: We support T/T, Western Union, PayPal, cash, etc. The details can be negotiated. Q4: What are your modes of transportation?A: We usually choose the appropriate mode of transportation (sea, air, land) according to the conditions of the goods, or we can choose the mode of transportation according to your requirements. Q5: How can I get an accurate quotation?A: You can first send your specific demand information and product pictures, and we will customize a solution for you according to your needs and inform you of the specific price.
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