IPDB › China Industry › Manufacturing & Processing Machinery
China, Chinese 20kHz Ultrasonic DIP Soldering Equipment for Aluminum Tinning1 Industrial Products Supplier Manufacturer Details, price list catalog:
China Industrial Products Supplier Manufacturer List Catalog
Metal Drawing MachineryUltrasonic Tinning PotUltrasonic DIP Welding
Hangzhou Lanben Trade Co., Ltd.
Preview:
Product Description Fluxless Soldering by 20khz Ultrasonic Soldering Pot for Wire Tinning System We offer a variety of methods to acoustically activate molten metal. Another popular method is to immerse a Power Probe's Wear-Tip directly into the molten material. The ultrasonic energy will remove dissolved gases and enhance grain structure refinement. The Permendur Power Probe offers the ability to acoustically activate molten metal in continuous or batch casting operations. Ultrasonic soldering is used to join materials with either a metallurgical or mechanical bond.A metallurgical bond is formed when the oxide from the base metal is removed through ultrasonic cavitation and implosion in the solder. The solder then comes in to contact with the base metal and the ionic attraction between the two forms a bond. A tin or lead solder bonded to copper is an example of this. A mechanical bond usually involves no oxide on the base material. The cavitation and implosion in the solder create forces that agitate the materials and form an interlocking mechanical bond.Coating a ceramic with solder is an example of this process. When to use Ultrasonic SolderingThere are two main reasons for using Ultrasonic Soldering:1. To eliminate the need for flux in the soldering process2. To apply solder to ceramics and similar materialsThe advantages of removing flux from the process are that there is no need for post-processcleaning and wicking caused by surface tension from the flux is removed. Eliminating post-processcleaning has the obvious benefit of cost saving for both the process and the flux itself. The benefit ofeliminating wicking is that the solder coating on the base material can be better controlled.Model No.RPS-DS20Ultrasonic Frequency20KhzMaximum Output1000 WattTemperature Range150 ~ 400 °CPower Supply220V / 50-60 HzUltrasonic GeneratorSize250(W) x 310(L) x 135(H) mmWeight5 KgFeatureUltrasonic Amplitude AdjustablePot dimension20*15cmAvail Soldering MatrialITO Glass, AL, Mo, Cu etc., Characteristics Easy soldering upon un-bondable material (metal, glass, ceramics) by simple dipping process.No need for fluxReliable bonding/sealingBest used in difficult, small-surface places with limited accessAluminum componentsFerrite componentsGlass componentsSilicon wafersCeramic componentsSemiconductor chipsMetals etc.
Purchasing Request
Note: Send your purchase request, and we will screen suppliers or manufacturers for you free of charge...